Events for “chip-packaging”

LG enters chip packaging arena with Laser Direct Imaging machine, as TSMC's CoWoS remains constrained — maskless machine is designed to pattern fine interconnec

As advanced packaging technologies like EMIB and CoWoS become yet another battlefield in the semiconductor industry, outsourced semiconductor assembly and test (OSAT) companies are trying new tools in a bid to offer services that others do not. This week, LG Electronics Productio